0.5mm Pitch FPC ZIF Flip-Lock Vertical SMT Type

Specifications

Material

Package Type

tape and reel‌、 ‌tube packaging‌、Tape and Reel Package

Note For Wafer Connectors, FPC Connectors, FAKRA Connectors, and HSD Connectors, please contact customer service to confirm the final packaging method based on product specifications, size, and quantity requirements.

Drawing/Model

Product Features

• Vertical SMT Orientation — Stands perpendicular to the PCB surface, freeing valuable board edge real estate for additional components or tighter layout density without requiring complex multi-layer routing. Benefit: enables more compact product designs while maintaining signal routing flexibility for the design engineer.

• ZIF Flip-Lock Mechanism — The hinged actuator locks the inserted FPC securely in place without requiring any insertion force, eliminating gold finger wear entirely and maintaining consistent contact pressure after hundreds of mating cycles. Benefit: extends FPC service life and reduces field failure rates in portable devices.

• Robust Contact System — Phosphor bronze contacts with selective gold plating deliver stable electrical performance across the full product lifetime. Contact resistance is maintained at ≤30mΩ, ensuring consistent signal integrity from -40°C through +105°C.

Request a datasheet to review complete mechanical drawings and PCB land pattern recommendations.

Application Scenarios

Consumer electronics manufacturers integrating high-resolution displays into tablets, smartphones, and wearable devices face a persistent design challenge: routing signal lines between the mainboard and display module within a continually shrinking enclosure. Standard horizontal connectors consume critical board-edge real estate, often forcing designers to compromise on component placement density or adopt costlier multi-layer board stacks.

The JKJ 0.5mm Pitch Flip-Lock Vertical SMT connector solves this by rising perpendicular to the board, freeing valuable perimeter space for passive components, shielding cans, or additional I/O ports. Its ZIF flip-lock design enables tool-free FPC insertion during high-volume assembly while maintaining secure retention against accidental dislodging. This makes it particularly well suited for portable device applications where reliability in a compact footprint is non-negotiable.

In communication equipment such as networking terminals, RF control boards, and base station interface modules, the same space-efficient profile simplifies multi-layer board routing and reduces overall assembly height. Discuss your specific application requirements with our engineering team for a tailored interconnect recommendation.

Why Choose 0.5mm Pitch FPC ZIF Flip-Lock Vertical SMT Type

• 20+ Years in Connector Manufacturing — Founded in 2000, JKJ has engineered interconnect solutions for over 500 clients across consumer electronics, automotive, and industrial sectors, bringing deep application experience to every project.

• IATF 16949 & ISO 9001 Certified — Our quality system ensures consistent product performance through traceable processes, from incoming material inspection through final electrical testing and packaging verification.

• Full ODM/OEM Capability — From standard 0.5mm pitch connectors to custom pin-count and plating configurations, our engineers collaborate directly with your team to develop tailored solutions for your specific layout constraints.

• RoHS Compliant & Environmentally Responsible — All materials fully comply with RoHS directives and global regulatory standards, supporting seamless export compliance for electronic equipment manufacturers.

Get started with JKJ — request a sample or pricing consultation for your next project.