2.0mm Pitch Right Angle DIP Pin Header: Right-Angle Through-Hole Reliability for Dense Boards

When a board is height-constrained but the connection still has to survive vibration, thermal cycling, and field service, the 2.0mm Pitch Right Angle DIP Pin Header is the form factor engineers default to. Its 90° bent, through-hole pins lie parallel to the board and present the contact row at the edge, so the header frees top-side clearance while keeping a solder joint that no reflow-weak SMT pad can match for mechanical hold and reworkability.

The 2.0 mm pitch itself is a deliberate compromise. It sits between the legacy 2.54 mm through-hole grid and the 1.27 mm / 1.0 mm high-density SMT pitches: dense enough to save board area, yet wide enough to stay easy to route, inspect, and hand-repair — and to keep the mature through-hole process cheap and dependable rather than chasing the tightest possible pitch.

The molded housing uses PA66 GF25 in a natural-color UL94 V-0 grade. Glass-fiber-reinforced nylon holds the insulator's geometry through lead-free soldering and a −40 °C to +105 °C service window, so pins stay seated instead of creeping and stressing the joint. UL94 V-0 is the flammability classification that requires a plastic part to self-extinguish after the ignition source is removed — the level expected inside enclosed equipment.

The terminals are stamped from H65 brass and plated 30 µin nickel under 100 µin matte tin. Matte tin is the pragmatic choice over gold for most signal and power paths: it solders and mates with low, stable resistance at far lower cost, while the nickel underplate blocks brass migration and corrosion. That combination is what delivers the header's 20 mΩ max contact resistance, 1000 MΩ min insulation, 1.0 A / 100 V AC/DC rating, and 800 V AC one-minute withstand.

Because the part is through-hole, it drops into wave or selective soldering lines and can be reworked with a standard iron — a real advantage over SMT when volumes are low or field repair matters. For designers qualifying a compact, right-angle interconnect, the 2.0mm Pitch Right Angle DIP Pin Header pairs a stable PA66 GF25 body with matte-tin terminals at a proven 2.0 mm pitch. Jinkeji supplies it within its interconnect range — contact our engineering team for samples and the full drawing.