Shenzhen JinKeJi Electronic Co., Ltd is a professional manufacturer and supplier specializing in high-performance Board-to-Board Connectors for advanced electronic systems. We focus on ultra-fine pitch, high-speed signal integrity, and high-density PCB interconnect solutions for global applications.
Our Board-to-Board Connectors support ultra-fine pitch designs from 0.3mm to 1.27mm, with pin counts ranging from 4 to over 240 positions. Stack heights range from 0.6mm to 30mm, enabling flexible integration across vertical, parallel, and coplanar PCB architectures.
We engineer every connector using high-performance LCP or PA9T insulating materials with UL94V-0 flame retardancy. Gold-plated terminals deliver stable performance with contact resistance ≤25mΩ and insulation resistance above 100MΩ. High-speed variants support up to 112 Gbps PAM4 transmission with controlled impedance of 50Ω ±3%.
To meet complex PCB architecture requirements, we offer a structured portfolio categorized by pitch, stacking height, and mating configuration. Proper selection ensures signal integrity, mechanical stability, and manufacturing efficiency in high-density systems.
| Pitch (mm) | Mounting Type | Stacking Options | Key Advantages |
|---|---|---|---|
| 0.3–0.5mm | SMT | Ultra-low profile mezzanine | Maximized PCB space efficiency for compact electronics |
| 0.8mm | SMT / Through-hole | High-speed stackable | Optimized for high-frequency and signal integrity systems |
| 1.0–1.27mm | SMT / THT | Vertical & perpendicular | Strong mechanical stability for industrial applications |
| 2.54mm | Through-hole | Coplanar / right-angle | High mechanical strength for testing and legacy systems |
Our mezzanine and stackable connectors are designed for high-density vertical PCB integration. With stacking heights ranging from 0.6mm to 30mm, they support compact multi-board architectures in advanced electronic systems.
These connectors feature precision alignment structures and optional floating contact designs to compensate for PCB tolerances up to ±0.5mm. This improves assembly yield and ensures stable electrical performance in complex stacked systems.
Our high-performance Board-to-Board Connectors are engineered for both high-speed signal transmission and reliable power delivery in demanding environments.
High-speed variants support up to 112 Gbps PAM4 signaling with controlled impedance of 50Ω ±3%. Advanced EMI shielding options reduce crosstalk by up to 40%, ensuring clean signal integrity in high-density systems such as servers and communication equipment.
At JinKeJi, we understand that standard components cannot always meet complex mechanical or electrical constraints. We provide full customization for Board-to-Board Connectors tailored to your system architecture.
Seamless Workflow: Direct collaboration from CAD design to prototype validation
Material Engineering: Custom LCP/PA9T selection, pin counts, and plating systems
Rapid Prototyping: Supports low-volume validation and mass production scaling
As your dedicated Board-to-Board Connectors manufacturer, we invite you to contact our engineering team. You can submit custom specifications, request product drawings, or consult on physical integration parameters.
When integrating Board-to-Board Connectors into PCB systems, selecting the correct stacking architecture is essential for electrical and mechanical optimization.
Parallel Stacking (Mezzanine):
PCBs are stacked vertically for compact devices such as smartphones, wearables, and medical modules.
Coplanar (Edge-to-Edge):
Boards are aligned horizontally for modular systems such as display units and testing platforms.
Perpendicular (Right-Angle):
Boards connect at 90 degrees, widely used in backplane systems and industrial controllers.
Quality is a core principle of Shenzhen JinKeJi’s manufacturing system. We implement strict quality control across all production stages to ensure consistent performance in critical applications.
Our Board-to-Board Connectors are manufactured under ISO 9001 and IATF 16949 quality systems, with full compliance to RoHS and REACH environmental standards. Materials include UL94V-0 flame-retardant LCP and PA9T housings.
Each product undergoes rigorous validation including thermal cycling, vibration testing, mating durability, and high-speed electrical performance verification.
Our high-performance interconnects are designed for advanced electronic systems requiring ultra-high density and high-speed data transmission.
Applications include smartphones, wearable devices, 5G base stations, AI computing servers, automotive ADAS systems, industrial automation equipment, medical diagnostic devices, aerospace electronics, and high-end communication infrastructure.
Choosing the right interconnect partner directly impacts system reliability and time-to-market. JinKeJi combines advanced manufacturing capability with flexible production models to support global customers across diverse industries.
We support the full product lifecycle from prototype development to mass production with stable quality, engineering support, and scalable delivery capacity.
Today, we maintain a proven track record of shipping reliable electronic components to clients across the US, Europe, Australia, and Asia.
What standard connector pitches do you manufacture for board-to-board applications?
We manufacture ultra-fine pitches from 0.3mm to 1.27mm, supporting high-density and high-speed PCB designs with up to 240+ positions.
Can you customize board-to-board connectors for unique stacking heights?
Yes, we offer full customization with stacking heights from 0.6mm to 30mm, including tailored pin lengths and housing structures.
Are your interconnect solutions compliant with automotive and environmental standards?
Absolutely. All products comply with ISO 9001, IATF 16949, RoHS, and REACH, using UL94V-0 rated materials for safety and reliability.
Do you support small-batch initial orders or rapid prototyping?
Yes, our flexible production system supports both rapid prototyping and scaled mass production to support full product development cycles.
