1.0Pitch Double-sided Vertical SMT

Specifications

Material

Package Type

tape and reel‌、 ‌tube packaging‌、Tape and Reel Package

Note For Wafer Connectors, FPC Connectors, FAKRA Connectors, and HSD Connectors, please contact customer service to confirm the final packaging method based on product specifications, size, and quantity requirements.

Drawing/Model

Product Features

This 1.0 Pitch Double-sided Vertical SMT Connector features contact arrays on both sides of the board edge, enabling vertical mating with corresponding daughter-card connectors for maximum circuit density in applications where board space is at a premium and every available millimeter must be utilized efficiently. The connector is fully surface-mountable, compatible with standard pick-and-place equipment and reflow soldering processes used in modern electronics manufacturing, enabling high-throughput automated assembly without manual soldering operations. The housing is manufactured from high-temperature thermoplastic that withstands lead-free reflow profiles without warping or dimensional change, maintaining precise contact alignment critical for reliable mating performance. Contacts are fabricated from copper alloy with gold plating in the mating area, providing low connection resistance and excellent corrosion resistance for long-term reliability in demanding operating environments. The connector's design includes alignment features that guide mating connectors into correct position, preventing pin damage during card insertion and ensuring consistent contact engagement across the entire array.

Application Scenarios

The 1.0 Pitch Double-sided Vertical SMT Connector is designed for laptop motherboards, solid-state drive modules, and compact embedded computing platforms where high circuit density must be achieved within a minimal board footprint to meet the demanding form factor requirements of portable and space-constrained electronic devices. Its double-sided contact arrangement effectively doubles the number of circuits compared to single-sided alternatives, enabling designers to route significantly more signals through a single connector footprint and reducing the total number of connectors required in the system. Telecommunications equipment employs this connector for backplane-to-daughter-card connections in rack-mounted switching and routing platforms where high port density is a competitive requirement. High-performance computing modules utilize it for linking processor boards to memory and I/O expansion cards within space-constrained chassis designs that must accommodate substantial computational resources. Industrial vision systems incorporate the connector for routing camera link signals between image processing boards. The surface-mount termination method enables automated pick-and-place assembly, reducing manufacturing cost and improving placement accuracy.

Why Choose 1.0Pitch Double-sided Vertical SMT

• Double-sided contact configuration of this 1.0Pitch Vertical SMT Connector enables simultaneous connection to two surfaces, maximizing routing efficiency in stacking designs.

• Fine 1.0mm pitch of this Double-sided SMT Connector provides high contact density, supporting multi-channel high-speed data in smartphone and wearable assemblies.

• Vertical SMT profile of this Double-sided Connector maintains low-height stacking, enabling thinner overall construction in portable and slim consumer device designs.

• Reflow-solderable construction of this Vertical SMT integrates into automated lines, ensuring consistent quality and efficient high-volume production processing.

• Proven design with broad mobile and wearable adoption, this Double-sided Vertical SMT is supported by technical resources for board-to-board and FPC integration.