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FPC 0.5mm Pitch Vertical SMT Top Contact No Shield Connector

Views: 0     Author: Site Editor     Publish Time: 2026-09-22      Origin: Site

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The FPC 0.5mm Pitch Vertical SMT Top Contact No Shield Connector from Shenzhen Jinkeji Technology Co., Ltd. is a board-to-flex interface that locks a 0.5 mm-pitch flexible circuit to a PCB. Its vertical, surface-mount body stands upright for stacked-module layouts and passes through standard lead-free reflow, while the top-contact mating face lets the flex cable insert from above and the no-shield housing keeps the footprint slim where board space is contested.

This FPC connector's housing is molded from LCP (liquid crystal polymer), a high-temperature thermoplastic that holds contact alignment through automated soldering. Terminals are phosphor bronze, tin-plated, with a gold-plated contact surface for stable, low-resistance mating. Electrically it is rated 0.5 A AC(rms)/DC at 50 V AC(rms)/DC, with 200 V AC/rms withstanding voltage, 500 MΩ min insulation resistance, and 40 mΩ max initial contact resistance. The operating range spans -40 ℃ to 105 ℃, and the UL94V-0 housing self-extinguishes without flaming drips. Produced under IATF16949 and ISO certified processes, it fits automotive-grade and general electronics manufacturing.

The FPC 0.5mm Pitch Vertical SMT Top Contact No Shield Connector is built for engineers who need a compact, reflow-ready flex interface in space-limited boards. Reach our engineering team with your pin count, FPC thickness, and board-height needs, and we will confirm footprint compatibility and sample availability.

What Is the FPC 0.5mm Vertical SMT Top-Contact No-Shield Connector Used For?

It serves as the board-side interface for a 0.5 mm-pitch flexible circuit in space-limited, automated-assembly designs. The vertical SMT body and no-shield footprint suit stacked modules where a display, sensor, or battery share one narrow enclosure, while IATF16949/ISO processes and a -40 ℃ to 105 ℃ range support automotive-grade builds that must survive reflow and harsh environments.

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