 |
10、103088-XXX111-1
| Current Rating：0.5A | Insulation Resistance：800MΩ/min |
| Voltage Rating：50V | Withstand Voltage：—— |
| Contact Resistance：≤30mΩ | Operating Temperature Range：-25℃~+85℃ |
| Plastic maerial：Nylon46 PA9T 6T LCP UL94V-0 | Terminal material：Phosphor Bronze |
tape and reel、 tube packaging、Tape and Reel Package
Note For Wafer Connectors, FPC Connectors, FAKRA Connectors, and HSD Connectors, please contact
customer service to confirm the final packaging method based on product specifications, size, and quantity requirements.
A 1.0mm pitch dramatically increases PCB connection density, enabling more I/O per square centimeter while leaving room for other critical components on the board.
Vertical orientation provides the most straightforward wire-to-board routing path, simplifying PCB trace layout and lowering the overall height profile of the assembly.
SMT mounting fully leverages high-speed pick-and-place automation, reducing per-connector assembly cost through faster cycle times and eliminating through-hole soldering steps.
Pin header contact architecture with 1.0mm pitch ensures firm mechanical retention, maintaining stable electrical contact under vibration and repeated insertion cycles.
The 1.0mm Pitch Vertical SMT Pin Header delivers a winning combination of fine-pitch density, SMT automation compatibility, and broad temperature tolerance for compact designs.
When a wearable design team packs display, processor, and battery into a slim watch housing, PCB real estate becomes the primary constraint. Every added connection competes for space that could otherwise serve sensors or battery cells. A 1.0mm Pitch Vertical SMT Pin Header resolves this conflict: its 1.0mm pitch allows dense signal routing on a narrow footprint, and the vertical orientation simplifies board-to-board interconnects in stacked layouts. The surface-mount design also eliminates through-hole clearance zones, reclaiming additional routing area on both sides of the board.
A handheld industrial terminal relies on internal board connections that survive repeated drop shock and vibration. Using larger-pitch connectors forces engineers to compromise between mechanical robustness and PCB space — a trade-off that becomes harder as devices shrink. The 1.0mm Pitch Vertical SMT Pin Header provides a practical answer: the 1.0mm pitch satisfies signal density requirements for compact control boards, while SMT termination creates solder joints that withstand mechanical stress. Its -25 to +85℃ operating range covers factory floor conditions without derating.
1.0mm Pitch Vertical SMT Pin Header With Cover—Full RoHS and ISO9001 compliance is verified across every production batch, ensuring consistent electrical performance and reliable solderability for high-volume SMT assembly in consumer electronics, industrial control, and IoT applications.
1.0mm Pitch Vertical SMT Pin Header With Cover—Established global brands offer deep ultra-fine-pitch connector portfolios, but Jinkeji provides broad stock availability, flexible pin count customization options, and competitive lead times for medium-to-high volume production runs.
1.0mm Pitch Vertical SMT Pin Header With Cover—Direct factory quality control and full batch traceability ensure every 1.0mm Pitch Vertical SMT Pin Header meets the reliability demands of modern compact electronic assemblies and automated SMT production lines.
