1.0mm Pitch Vertical SMT Pin Header

Specifications

Material

Package Type

tape and reel‌、 ‌tube packaging‌、Tape and Reel Package

Note For Wafer Connectors, FPC Connectors, FAKRA Connectors, and HSD Connectors, please contact 

customer service to confirm the final packaging method based on product specifications, size, and quantity requirements.

Drawing/Model

Product Features

A 1.0mm pitch dramatically increases PCB connection density, enabling more I/O per square centimeter while leaving room for other critical components on the board.

Vertical orientation provides the most straightforward wire-to-board routing path, simplifying PCB trace layout and lowering the overall height profile of the assembly.

SMT mounting fully leverages high-speed pick-and-place automation, reducing per-connector assembly cost through faster cycle times and eliminating through-hole soldering steps.

Pin header contact architecture with 1.0mm pitch ensures firm mechanical retention, maintaining stable electrical contact under vibration and repeated insertion cycles.

The 1.0mm Pitch Vertical SMT Pin Header delivers a winning combination of fine-pitch density, SMT automation compatibility, and broad temperature tolerance for compact designs.

Application Scenarios

Wearables — PCB Density Constraints

When a wearable design team packs display, processor, and battery into a slim watch housing, PCB real estate becomes the primary constraint. Every added connection competes for space that could otherwise serve sensors or battery cells. A 1.0mm Pitch Vertical SMT Pin Header resolves this conflict: its 1.0mm pitch allows dense signal routing on a narrow footprint, and the vertical orientation simplifies board-to-board interconnects in stacked layouts. The surface-mount design also eliminates through-hole clearance zones, reclaiming additional routing area on both sides of the board.

Industrial Automation — Vibration Reliability

A handheld industrial terminal relies on internal board connections that survive repeated drop shock and vibration. Using larger-pitch connectors forces engineers to compromise between mechanical robustness and PCB space — a trade-off that becomes harder as devices shrink. The 1.0mm Pitch Vertical SMT Pin Header provides a practical answer: the 1.0mm pitch satisfies signal density requirements for compact control boards, while SMT termination creates solder joints that withstand mechanical stress. Its -25 to +85℃ operating range covers factory floor conditions without derating.

Medical Devices — Thermal Cycling Demands

A portable patient monitor design requires internal connections that stay reliable through transport, storage at varied temperatures, and repeated handling. Connectors with restricted temperature ratings introduce risk when equipment moves between cold storage and operating environments. The 1.0mm Pitch Vertical SMT Pin Header, rated for -25 to +85℃, maintains stable contact integrity across these thermal cycles. Its surface-mount format also supports automated pick-and-place assembly, reducing manufacturing variation in critical medical device production. The result is a connector that contributes to both production yield and long-term patient safety.

Why Choose 1.0mm Pitch Vertical SMT Pin Header

Full RoHS and ISO9001 compliance is verified across every production batch, ensuring consistent electrical performance and reliable solderability for high-volume SMT assembly in consumer electronics, industrial control, and IoT applications.

Established global brands offer deep ultra-fine-pitch connector portfolios, but Jinkeji provides broad stock availability, flexible pin count customization options, and competitive lead times for medium-to-high volume production runs.

Direct factory quality control and full batch traceability ensure every 1.0mm Pitch Vertical SMT Pin Header meets the reliability demands of modern compact electronic assemblies and automated SMT production lines.